Shafer

Case Solution for BPO, Incorporated

Complete Case details are given below :
Case Name :      BPO, Incorporated
Authors :           Scott M. Shafer
Source :             North American Case Research Association (NACRA)
Case ID :            NA0042
Discipline :        Operations Management
Case Length :    15 pages
Solution sample availability : YES
Plagiarism : NO (100% Original work)
Description for case is given below :
The Employee Benefit Outsourcing (EBO) unit of BPO, Inc. is experiencing rapid growth as a result of industry trends toward greater outsourcing of business processes. Despite rapid growth in revenues, the EBO unit has not been able to make a profit in part because of problems with its operations. A Six Sigma project has been initiated with the goal of developing a computer simulation model of the Health and Welfare Service Delivery process to help get a better handle on the operational problems. The define-and-measure phases of the Six Sigma project have been completed and the case includes the project charter, a process map, detailed operational data, and process performance benchmark data. Students are to use the data provided to develop their own simulation model, validate it with the benchmark data provided, and then use the model to complete the analyze, improve, and control phases of the Six Sigma project. More specifically, students can use the simulation model to test incremental changes to the current process as well as test more radical changes to the process such as the high-touch, low-cost option proposed by EBO’s new Senior VP of Operations.

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Case Solution for General Micro Electronics, Incorporated: Semiconductor Assembly Process

Complete Case details are given below :
Case Name :      General Micro Electronics, Incorporated: Semiconductor Assembly Process
Authors :           Scott M. Shafer, Charles Volk
Source :             North American Case Research Association (NACRA)
Case ID :            NA0217
Discipline :        Operations Management
Case Length :    15 pages
Solution sample availability : YES
Plagiarism : NO (100% Original work)
Description for case is given below :
General Micro Electronics (GME) designed, assembled, and tested semiconductors for wireless, memory management, wire line telecommunications, and networking applications. In January it purchased a new wire-bonder machine to support its growing contract assembly business. For the first couple of months the new machine performed well, but then its performance became more erratic and eventually was no longer meeting its internal standard for wire-bond strength. The strength of the wire-bond was an important quality dimension of semiconductor chips. With the use of overtime on the existing wire-bonding equipment being very close to full utilization, the need to improve the performance of the new wire-bonding machine was becoming critical. GME’s operations personnel were continuously tweaking the new machine in an effort to find a combination of process parameters that would improve the machine’s performance. Unfortunately, the performance of the machine continued to deteriorate.
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