Complete Case details are given below :
Case Name : General Micro Electronics, Incorporated: Semiconductor Assembly Process
Authors : Scott M. Shafer, Charles Volk
Source : North American Case Research Association (NACRA)
Case ID : NA0217
Discipline : Operations Management
Case Length : 15 pages
Solution sample availability : YES
Plagiarism : NO (100% Original work)
Description for case is given below :
General Micro Electronics (GME) designed, assembled, and tested semiconductors for wireless, memory management, wire line telecommunications, and networking applications. In January it purchased a new wire-bonder machine to support its growing contract assembly business. For the first couple of months the new machine performed well, but then its performance became more erratic and eventually was no longer meeting its internal standard for wire-bond strength. The strength of the wire-bond was an important quality dimension of semiconductor chips. With the use of overtime on the existing wire-bonding equipment being very close to full utilization, the need to improve the performance of the new wire-bonding machine was becoming critical. GME’s operations personnel were continuously tweaking the new machine in an effort to find a combination of process parameters that would improve the machine’s performance. Unfortunately, the performance of the machine continued to deteriorate.
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